PRODUCTS
VERTRON Family for 200mm Wafers

• VERTRON III - Vertical Diffusion/LPCVD systems
• VERTRON - Load / Lock Vertical Diffusion/LPCVD Systems
• VERTRON EPI - Epi process configuration

VERTRON-III series

Vertical Diffusion/LPCVD systems especially for 200mm wafers which are predominantly used in high-volume-semiconductor device manufacturing. Hitachi Kokusai Electric has shipped over 5000 systems. The VERTRON-III platform offers solid reliability and provides superior cost of ownership (Co0)to our customers.

The VERTRON-III offers all conventional films as well as the unique processes of BTBAS Si₃N₄, ALD Si₃N₄ and Selective SiGe epitaxy.

VERTRON Series
As semiconductor devices become more highly integrated and miniaturized, it is necessary to control native oxide film growth on the wafer surface at the time of loading for applications such as formation of contact Poly-Si, capacitor nitride, ultra thin oxidation and selective oxidation, etc.

Kokusai recommends its VERTRON-V Vacuum Load Lock vertical Diffusion/LPCVD System for these processes to utilize the unique oxygen and moisture free load lock chamber mounted directly underneath reactor tube. This is a true vacuum load lock. Once the wafers are loaded into the boat, the chamber is sealed and N₂ cycle purged of oxygen and moisture, creating an environment of <1 ppm O₂ and H₂O.

Process Applications

Features

• Native oxide free process by oxygen and moisture free load lock chamber mounted directly underneath reactor tube.

• Greatly reduced contact resistance and effective thickness of capacitor
• Reduced oxygen concentration level in Poly Si film which leads lower resistance after doping
• Capability of control native oxide film growth by controlling oxygen concentration in a load lock chamber
• Supports oxygen sensitive processes such as Selective Oxidation for Poly-Metal gate, SiGe Epi base formation and Cu/Low-k annealing process.
• High throughput by providing large batch size
• Maximum system uptime by self-cleaning capability.
• High throughput by optional fast ramp heater element while maintaining low thermal budget.
• Excellent yield and film thickness uniformity by optimized process conditions and clean air flow in loading area of the system.
• Easy maintenance by heater element moving mechanism.
• Minimum overhead time by reliable and speedy wafer handling mechanisms. Wafer handling robot can transfers 5 wafers simultaneously.
• High speed, reliable and low vibration cassette loading mechanisms.
• Automatic filler dummy wafer supply by wafer detection mechanism.
• SEMI standard compliant wafer I/O stage
• Supports SMIF interface
• Effective space utilization of side-by side layout by side access free design
• User friendly GUI tube controller (CX3000 series) which supports process logging data analysis capability.
• SECS/GEM compatibility for factory automation.