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- Curing
- Low temp. annealing
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TANDUO has modular a design that enables you to create the optimal system to suit your specific processing needs. Select modules to accommodate a variety of processes, such as curing, annealing, and degassing. This combined with our proprietary high-speed wafer transfer system will enable you to achieve highly productive, low-particle processing. |
- Achieves high throughput thanks to our proprietary high-speed wafer transfer system
- Proprietary susceptor heater enables highly uniform control of internal wafer temperature
- Low contamination levels
- Small footprint, high uptime
- Boasts high sales worldwide as a highly productive, high throughput single-wafer annealing system
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