TANDUO
 

Process Applications

  • Resist Strip
    • Bulk Photoresist Strip
    • High-Dose Implant Strip
  • Low Temperature Anneal
 
TΛNDUO offers dramatically improved throughput using a totally redesigned platform. Incorporating Hitachi Kokusai's production-proven Lambda Series plasma source, TΛNDUO offers an ultra high speed ashing process solution with minimum plasma damage and lowest CoO, compared with other available solutions.

Features

  • High throughput
  • High rate, damage free ashing with helical resonator type plasma source
  • Low Contamination
  • Compact Footprint
  • Other applications include high throughput single wafer annealing