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QUIXACE is Kokusai's new platform for vertical, batch processing of 300mm wafers. QUIXACE offers throughput enhancements on core diffusion and LPCVD technologies through advances in temperature control, wafer handling automation, reactor purge, and temperature ramping. Incorporating over 20 years of vertical, batch technology
into one platform.
The QUIXACE platform is available in a number of configurations including Large Batch (QL), Vacuum Load Lock (QV), Mini Batch (QM), Nitrogen Purge Load Area (QLN or QMN). Several standard options are also available for continuous batch processing. Batch configurations adaptable for large and small load-sizes (50-125 wafers/batch). |
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BCD ( Balance Controlled Deposition ) |
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LP CVD |
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- Nitride( Low Temperature, Si rich Nitride) |
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- Poly, SiO, TEOS |
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Oxidation |
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- BIO ( Batch Isotropic Oxidation ) |
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- Pyro/Wet, Dry |
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Anneal |
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- High Temperature N2, Ar, H2 |
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- Ultra High Temperature for SOI |
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- Low Temperature Cure |
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- Cu Anneal |
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Epitaxial Growth |
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- SiGe/Ge Selective Epi |
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- Bulk Epi |
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