The Lambda ashing tool is Kokusai's new platform for photo resist ashing of 300mm wafers. The process of stripping the photoresist mask is carried out in a dry, eco-friendly process using plasma. Kokusai technology enables high throughput rates at low cost of ownership. Kokusai’s unique proprietary plasma chamber design results in no damage to the gate oxides and exhibits much higher ashing rates compared to competing technologies. Besides high throughput and no plasma damage, its small footprint is a distinct advantage over competing solutions.
FEATURES:
- Dual Processing Chambers
- Two finger vacuum wafer transfer Robot
- Independent functioning Dual Load Lock Chambers
- Standard FOUP capability
- Sensor bus systems featuring high reliability and low cost
- ATM wafer transfer
- Plasma Damage Free Process
- Wide Variety of Processes (Bulk Ash etc.)
- Good Uniformity
- High Ashing Rate
- High Throughput
- Small Footprint
- Easy Maintenance
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