ADVANCED PRODUCT / APPLICATION SUMMARY
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Ultra-high Temperature Anneal System
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High Quality Wafer |
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- High Throughput
- Slip Free
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MMT Plasma System
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Gate Dielectric
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- Wide Nitrogen Concentration Control
- High-density, Low-electron Temperature Plasma With Excellent Uniformity
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Low Temperature. Processing System
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Side Wall Spacer/CESL |
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- Low Temperature Thin Film Deposition
- Excellent Film Qualities
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Si/SiGe Epi Batch System
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Selective Epi-Si (SiGe) |
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- Defect Free Si/SiGe Epi
- High Productivity
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Advanced Batch Thermal Process System
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Oxidation, LP-CVD Anneal |
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- High Throughput
- Short Cycle Time Production
- Flexible Charge Size
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Low Temp. Anneal System
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BEOL Anneal |
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- High Throughput
- Quick Recovery
- Excellent Stable Heater
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Dry Strip System
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Resist Strip |
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- High Throughput
- Low Plasma Damage
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