The VR300DS is an automatic system for performing sheet resistivity testing on surface layers of semiconductor wafers. The system includes a wafer handling stage platform for carrying a semiconductor wafer, and a carriage that accurately positions a test probe.
The carriage carries a resistivity test probe which includes 4- probe element that contacts the surface of the semiconductor wafer. A light tight housing surrounds the measurement platform. Robotics employ optical sensors for all positioning operations to insure no movements result in accidental surface contacts or damage. All movements and measurements are under microcomputer control.
FEATURES:
- High Availability
- High Throughput
- Small Footprint
- Easy Maintenance
- 300mm Demo Available
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