The process of plasma ashing or plasma stripping is the
removal of organic matter by an oxygen plasma. The resulting carbon oxides and water vapor
are volatile and pumped away by the vacuum system. The most common application of this technology is for
the removal of photoresist which is composed of organic
compounds, essentially consisting of carbon, hydrogen and oxygen. Exposure to an oxygen plasma
removes all the photoresist leaving no residues.
The process of stripping the photoresist mask is carried out in a dry, eco-friendly process using plasma (‘ashing’). KSEC technology enables high throughput rates at low cost of ownership. Kokusai's unique proprietary plasma chamber design results in no damage to the gate oxides and exhibits much higher ashing rates.
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